Thermal Management (`thermal-management`)

Thermal Management

Heat sinks, cold plates, radiation and thermal-resistance networks

Standards catalog

Validation: indicative · Method band: formula

Open calculator

Indicative method: Parallel conduction, convection and radiation heat-transfer screening

Assumptions

Linear elastic material behavior unless noted otherwise.
User is responsible for load combinations and load factors per the selected design code.
Design standard (US/EU/ISO) sets unit defaults and screening check labels — not a full code worksheet.

Limitations

Lumped steady-state model; CFD, spreading resistance, two-phase flow and contact resistance are not included.

Engineering checks

Check	IND	US	EU	ISO
Heat-transfer capacity	implemented	—	—	—
Thermal resistance	implemented	—	—	—
Coolant temperature rise	implemented	—	—	—

Purpose

Combine parallel conduction, convection, radiation, and coolant flow estimates for steady-state heat rejection from electronics, cold plates, and advanced hardware. Reports effective thermal resistance and coolant temperature rise.

Physics & theory

Heat flows through parallel paths from hot surface at $T_{h}$ to ambient. Conduction through solid: $Q_{c} = k A Δ T / t$ . Convection to fluid or air: $Q_{conv} = h A Δ T$ . Radiation: $Q_{r} = ε σ A (T_{h}^{4} - T_{amb}^{4})$ .

Total capacity $Q_{tot} = Q_{c} + Q_{conv} + Q_{r}$ (screening sum). Effective resistance $R_{th} = Δ T / Q_{tot}$ . Coolant mass flow required: $\overset{m}{˙} = Q_{tot} / (c_{p} Δ T_{coolant})$ .

Advanced systems calculators use lumped-parameter screening models suitable for concept trade studies. Each calculator returns explicit assumptions and warnings arrays documenting model limits. Constants such as ( sigma ) (Stefan–Boltzmann), ( mu_0 ), and ( R ) (gas constant) use SI definitions from the solver source.

Results are not certified for regulatory submission without independent verification against detailed analysis or test data.

Governing equations

Q_{c} = \frac{k A Δ T}{t}, Q_{conv} = h A Δ T

Q_{r} = ε σ A (T_{h}^{4} - T_{amb}^{4})

R_{th} = \frac{Δ T}{Q _{tot}}, Δ T_{coolant} = \frac{Q _{tot}}{m ˙ c _{p}}

Numerical method

Parallel path capacity summation (advanced-systems/calculators). Paths treated as independent capacity estimates — not series thermal network unless user configures equivalent $Δ T$ .

Inputs

Parameter	Description
`deltaT`, `area`	Driving potential and area
`thickness`, `conductivity`	Conduction path
`convectionCoefficient`	$h$ (W/m²·K)
`emissivity`, `hotTemperature`, `ambientTemperature`	Radiation
`flowRate`, `coolantCp`	Liquid cooling

Outputs

Conduction, convection, radiation components (W), total capacity, thermal resistance (K/W), coolant rise (K).

Design codes & checks

Indicative: Heat-transfer capacity, thermal resistance screening
JEDEC: Electronics thermal practice (context)
ASHRAE: Heat transfer data (reference)

Assumptions & limitations

Steady-state lumped model; no transient or spatial gradients.
Parallel path summation may overestimate if paths are actually series-dominated.
No spreading resistance, contact interface resistance, or two-phase boiling.
CFD and fin efficiency not computed.

References

Incropera, F. P., et al. Fundamentals of Heat and Mass Transfer, 8th ed.
JEDEC JESD51 series. Thermal characterization of semiconductor devices.
ASHRAE Handbook — Fundamentals.
Lee, S. Optimum Design and Selection of Heat Sinks. IEEE Trans. COM-25.
PhyCalcPro verification benchmarks in src/data/verification/ where available for this module.
Beer, F. P., et al. Mechanics of Materials, 8th ed. McGraw-Hill — foundational stress and deformation theory.

Maintainer note: Lumped conduction, convection, radiation and coolant estimates.

Thermal Management

Assumptions

Limitations

Engineering checks

Thermal Management (thermal-management)

Thermal Management (`thermal-management`)